C10400 - SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing StdPbc-0626 SEMI M49-0912 (technical revision)

SEMI M49-0912 (technical revision)

Referenced SEMI StandardsSEMI G55 — Test Method for Measurement of Silver Plating Brightness

Originally published October 2000

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information that does not change dynamically while the equipment is running)

C10400 - SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing StdPbc-0626 SEMI M49-0912 (technical revision)This Guide provides directions for measurements and reporting the parameters of chemical mechanical planarization (CMP) pad windows. This Guide provides directions for reporting metrology tools used to measure parameters of the CMP pad windows. This Guide provides the list of the parameters for CMP pad windows required to measure and report on quality documents. Reference to this Guide can be used in the quality documents (i. e., in the technical data