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本基準包含下列章節：
SEMI T3-0697E2 (editorial revision)
and services for the organizations and entities involved in authentication of semiconductor and related products or objects through the use of secure serialization
A generic overlay performance assessment specification will be addressed in order to provide criteria and common baselines of the middle-end process for related upstream and downstream manufacturers fabricating the 3DS-IC products
Compliance requires a specific set of standard services
MS00500 - SEMI MS5 - Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures Revision:SEMI MS5-1211 - Superseded 本基準包含下列章節：1 Purpose 1. 1 This Test Method enables the determination of the bond strength between two wafers using micro chevron test structures. Wafer wafer bonding is a mainstay for microelectromechanical system (MEMS) and three dimensional stacked integrated circuits (3DS IC) design and fabrication. MEMS components, such as acceleration sensors, gyroscopes, micropumps, or microvalves that are increasingly found in smart automotive and navigation control
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