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1-1015 (technical revision)
Cam-follower edge rounding usually results in wafers that are circular
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6-0703 (Reapproved 0623) — Specification for Round 150 mm Polished Monocrystalline Indium Phosphide Wafers (Notched)
SEMI MF1153-92 (Reapproved 2002) (first SEMI publication)
E18500 - SEMI E185 - Specification for 300 mm Tape Frame FOUP StdTpc-FPD Metrology 1-1015 (technical revision)1 Purpose 1. 1 The purpose of this Specification is to establish basic physical dimensions for the Tape Frame FOUP which is intended to be used to transport and store 300 mm tape frames, as specified by SEMI G74 and SEMI G87, within IC manufacturing facilities. 2 Scope 2. 1 This Standard specifies the external features and dimensions of the Tape Frame FOUP. 2. 2 This Standard specifies the internal dimensions for storing the tape frames in the Tape