M08500 - SEMI M85 - Guide for the Measurement of Trace Metal Contamination on Silicon Wafer Surface by Inductively Coupled Plasma Mass Spectrometry StdTpc-Glass Wafer Equipment Communication Standards1 Messages Transfer

Equipment Communication Standards1 Messages Transfer (SECS-I) or the protocol defined in SEMI E37

This Guide covers the shipping of 300 mm nominally diameter silicon wafers

1 — Specification for Inspection and Review Specific Equipment Model (ISEM)

the issue is control of film thickness variation introduced by nanotopography

SEMI E139 — Specification for Recipe and Parameter Management (RaP)

M08500 - SEMI M85 - Guide for the Measurement of Trace Metal Contamination on Silicon Wafer Surface by Inductively Coupled Plasma Mass Spectrometry StdTpc-Glass Wafer Equipment Communication Standards1 Messages TransferReduction of surface metal contamination below a concentration in accordance with the ITRS road map is a key issue for silicon wafer quality for most of the leading edge technology applications. This Document provides a guide for a high sensitivity measurement of trace metal contamination on the surface of a semiconductor grade silicon wafer by using inductively coupled plasma mass spectrometry (ICP MS). This Guide describes the procedure for trace